New SIPLACE Second Level Reel Holder

More space and increased usability: for the SIPLACE X changeover tables, the SIPLACE team now offers a new Second Level Reel Holder. Perfectly suited for products requiring high volumes of mostly small components, the Second Level Reel Holder allows for easier transportation and faster and more efficient setups and changeovers.

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New SIPLACE Di at the SIPLACE Application Center

From now on interested electronics manufacturers have the chance to take a closer look at the new SIPLACE Di: at the SIPLACE Application Center in Munich you can experience the many impressive standard features of the SIPLACE Di series. Find out what advantages the SIPLACE Di can offer you – all for a unique price-performance ratio.

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New SIPLACE tour date – Come visit us!

You want to take a look behind the scenes of the SIPLACE Factory, which was recently rewarded with the "Best Factory of the Year" Award? During a one hour tour at the SIPLACE headquarter in Munich on July, 2, 2013 you get to see how a record-setting placement machine is made and what this means for the world of SMT. Experience the SIPLACE team in action!

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SIPLACE lines for automobile electronics and smartphones at Nepcon Shanghai 2013

Smartphones and automotive electronics — ASM Assembly Systems presented its new placement platforms and innovative line concepts for both SMT applications at this year’s Nepcon Shanghai trade show. On the smartphone line, the latest generation of SIPLACE placement solutions was unveiled: both the SIPLACE X4i S and the SIPLACE X3 S deliver record performance ratings. The automotive electronic line with the SIPLACE flagship SIPLACE SX focused more on process reliability, traceability and the special requirements of the LED placement process.

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Grundig Business Systems and SIPLACE celebrate a new SIPLACE SX

At the 2013 SMT Hybrid Packaging show, SIPLACE account manager Horst Schmitt and Grundig Business Systems’ production head Martin Halwas took the opportunity to celebrate the successful startup of Grundig’s newly acquired SIPLACE SX. Equipped with a SIPLACE MultiStar placement head, the new machine has been integrated into a flexible high-performance line of the Bayreuth-based company. "We have operated with SIPLACE equipment for many years and have a wide range of machine types and generations in our production", said Grundig Business Systems production head Martin Halwas. "With the new SIPLACE SX we were predominantly looking for maximum flexibility."

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Successful SMT 2013 for ASM Assembly Systems

New products from hardware, software and services: the ASM Assembly Systems booth at the SMT Hybrid & Packaging 2013 was a definite crowd pleaser. The great interest was not only created by putting a focus on "SIPLACE solutions for the entire production workflow" – two new SIPLACE placement machines also were successfully unveiled this year: The new SIPLACE X3 S, part of the latest generation of the SIPLACE X high-end platform, and the SIPLACE D1i, a new solution for the more price-sensitive SMT production segment, had a successful premier at Nuremberg.

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ASM Back End Systems at the SMT Hybrid Packaging 2013

Why not meet the team of ASM Back End Systems at this year's SMT Hybrid & Packaging trade show in Nuremberg? At Booth 204 in Hall 7, the experts will among other things unveil the new highly flexible die bonder for multichip modules and SiPs, present you a look at their product portfolio and be available for you with valuable expertise and advice.

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SIPLACE shines a spotlight on Automotive electronics

The SIPLACE team of ASM Assembly Systems puts a strong focus on the challenges and processes of Automotive electronics manufacturers this year. The leading SMT equipment supplier in this field for decades, SIPLACE has now released a new SIPLACE Insights brochure on the topic which highlights SIPLACE solutions especially well-suited for intricate Automotive electronics processes.

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Experience SIPLACE - at SMT Hybrid Packaging 2013

Hall 7, Booth 204, April 16-18, Nuremberg
 
With new SIPLACE placement machines and many software innovations, SIPLACE will present a multitude of new products in Hall 7, Booth 204 at this year’s SMT Hybrid Packaging in Nuremberg. Several highlights will be at the center of attention from April 16 to 18: With the SIPLACE X3 S, ASM Assembly System will unveil the new generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment. Also new is the SIPLACE Very High Force Head for placement forces of up to 70 newtons. The SIPLACE team will also demonstrate its leadership in the areas of software and workflow support for materials management.

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APEX 2013 videos: SIPLACE experts talk up industry’s important topics

The APEX Expo in San Diego was a big success for the SIPLACE Team. SIPLACE Marketing Manager Americas Mark Ogden was excited about the show-goers’ response: "The SIPLACE booth was continually busy with visitors. We were very happy that our message was so well received." Interesting discussions and roundtables were held, and SIPLACE experts were ready to join in.

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New Traceability option: Reading barcodes on circuit boards

With the new version 3.5 of its Traceability option, the SIPLACE team enhances the option to trace individual PCBs and components even further by tying all components to a barcode ID on each circuit board.  The barcode labels may be placed onto the PCBs immediately after they enter the machine or during the placement process, and the SIPLACE Label Feeder makes it especially easy to seamlessly integrate this step into the production flow.

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SIPLACE VHF Head: Lots of power for large connector modules

From now on, very large components up to 30 millimeters high and 200 millimeters long can be placed with the SIPLACE Very High Force Head. Available for the SIPLACE SX and with a force of up to 70 newtons it can process odd shaped components with snap-in or through-the-hole fasteners. To supply these large components, an optimized version of the SIPLACE Waffle Pack Changer (WPC) is available as well.

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Together #1 – Rise through the ranks at SIPLACE

The SIPLACE team is looking for fresh talent, because the innovation leader in the field of surface-mount technology is continuously expanding. Especially in demand at this time: Engineers for the SIPLACE development department in Munich.

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SIPLACE at the 2013 APEX show

At the center of the company’s show the SIPLACE Team of ASM Assembly Systems presents the highly flexible SIPLACE SX placement platform Februrary 19 to 21. A special focus is on the SIPLACE Teams intelligent software solutions. A highlight will be the demonstration of SIPLACE’s Random Setup concept. Other innovations to be shown at the booth 215 include the SIPLACE Smart Pin Support, the SIPLACE Glue Feeder and the SIPLACE Smart GUI.

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SIPLACE LED Pairing: creating new paths for electronics production

With its LED Pairing feature ASM Assembly Systems redefines once again the limits of electronics production: with the new SIPLACE LED Pairing process, LEDs and their associated resistors can now be selected and placed on both sides of the circuit board.

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JSD Polska is the new SIPLACE partner in Poland

Since December 1, 2012, the SIPLACE team is being represented in Poland by the SMT experts of JSD Polska. The company, which was founded in 2004, has long-term experience in PCBA capital equipment sales and service. It is also intimately familiar with the emerging Polish market and is convinced that "ASM Assembly Systems products are very versatile and flexible: the perfect solution for the Polish market."

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SIPLACE Alternative Tracks adds more flexibility to the SMT line

SIPLACE Alternative Tracks makes the setup process in electronics manufacturing even more flexible:  where splicing should be avoided the new function makes it possible that after one component reel runs out,  the job can still continue running non-stop with predefined alternative components – the system automatically switches to an alternate, which can be set up on any track. Combining Alternative Tracks with the well-known Alternative Components function makes the line even more flexible.

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SIPLACE Stationwise Download: Seamless setup changeovers

Being able to change setups on the line quickly and efficiently is especially important in modern high-mix electronics production environments – they can help to save precious time and costs. This is where SIPLACE Stationwise Download comes into play, an option within the SIPLACE Line Operations Package. With SIPLACE Stationwise Download you can reduce the downtime during product changeovers considerably: the line does not have to be emptied any longer and changeover procedure takes place without having to stop the line.  On a line with four machines, for example, changeover time can be reduced from approximately 9 minutes to as little as 47 seconds.

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Improved communication tools for SIPLACE users at the new SIPLACE forum

With the new SIPLACE discussion forum, SIPLACE has realized its customers’ incentives and now offers them an opportunity to exchange experience, get in touch with other users and to discuss with them. In order to participate actively, it merely requires a registration with the SIPLACE User Group. 

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SIPLACE supports inaugural Emerging Electronics Event 2012

 The SIPLACE UK & Ireland Team recently participated in the inaugural Emerging Electronics Event 2012 organised by SMS Electronics, Nottingham. SMS Electronics, a well-known EMS company and a long-standing SIPLACE customer had been granted the Queens Award for Enterprise in International Trade earlier this year. Now a number of key suppliers to SMS were invited to take part in this special event which was a mixture of workshops and presentations and took place at the East Midlands Conference Centre, part of the prestigious Nottingham University Campus. Here Sebastian Weckel of the SIPLACE team showcased the latest SIPLACE PCB manufacturing concepts.

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SIPLACE exhibits "New Product Introduction" tools at inaugural ENOVA

For the first time the ENOVA, a new show dedicated to the electronics industry, took place from 13 to 16 June 2012 in Tunis, Tunisia. Strongly supported by the Tunisian authorities and organized by MEDINDUSTRIE, the International Exhibition for Industrial Cooperation and Innovation, all the main players in the electronics industry in Tunisia, either OEM manufacturers or subcontractors, were present as exhibitors as well as visitors. SIPLACE participated at the show with the concept "New Product Introduction".

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