Flexible like a feeder SIPLACE Gluefeeder delivers significant cost and process benefits for selective gluing
With the new SIPLACE Gluefeeder, ASM Assembly Systems is presenting a completely new solution for dual-sided boards and other applications requiring the selective gluing and fastening of SMT components at this year's SMT Hybrid Packaging Nuremberg trade show (Hall 7 Booth 204). Unlike other gluing systems, the SIPLACE Gluefeeder is not permanently integrated into the placement machine or screen printer, but can be flexibly set up like any other feeder. During the placement process, the head guides the components over the dispenser where a program-controlled precision jet applies precise glue dots to them before they are affixed to the board.
The SIPLACE Gluefeeder delivers a whole series of benefits: Since the dispenser can be set up virtually anywhere, products requiring glued components can now be produced on different lines. Since the glue is applied to the components and not to the board, no cumbersome cleaning process is needed when something goes wrong. And the costs drop, because the Gluefeeder eliminates the need to invest in expensive gluing stations. For more information, please visit ww.siplace.com/SMT2012.
Particularly with dual-sided boards, large components often cause problems because they can easily fall off or slip during the second pass through the reflow oven. To keep this from happening, modern factories affix such components with adhesive. In the past, special gluing stations or adhesive dispensing systems were used for this purpose which were permanently integrated into screen printers or placement machines. With the SIPLACE Gluefeeder, the SIPLACE team now presents a totally new process approach and an innovative solution for selective gluing that eliminates the serious deficiencies and commercial risks of traditional glue dispensing systems.
Flexible like a feeder
The SIPLACE Gluefeeder does not become a permanent part of the placement machine, but is set up on the feeder table as needed, just like a regular feeder. With this approach, it converts any modern SIPLACE placement machine into a gluing station. Instead of being able to process products requiring gluing only a few lines which are equipped with special and expensive gluing stations, the SIPLACE Gluefeeder enables electronics manufacturers to use any line and plan in a more flexible and utilization-oriented manner. If multiple components need to be glued, the gluing performance is easily scalable by simply adding more Gluefeeders. Another advantage: While fixed glue dispensing systems often lead to a permanent reduction in the placement machine's performance, the SIPLACE Gluefeeder slows it down only slightly when it is used and not at all when no gluing is needed.
Jet dispenser applies glue selectively and upward
Most traditional glue dispensing systems apply the glue downward and over a large area directly to the PCB. The SIPLACE Gluefeeder works very differently: Using a modern jet dispenser, it rapidly "shoots" minute glue droplets upward and with exceptional accuracy onto the component to be affixed. To get the glue treatment, the component is simply moved across the SIPLACE Gluefeeder after having been picked up by the placement head. By turning the glue application around, the SIPLACE engineers developed additional cost and process benefits: Instead of requiring special vision systems, the glue application can now be checked with the placement machine's regular cameras. If the system detects a flaw, it simply discards the component and repeats the process. Thus even a faulty glue application costs less than with traditional systems, where the entire board must be either discarded or cleaned at great expense.
Improved process reliability
At the same time, the SIPLACE Gluefeeder reduces the error rate, because all the data regarding PCBs, components and fiducials is readily available, and with the jet dispenser the glue application can be controlled much more accurately than before – with traditional tools and placement programs. The Gluefeeder even handles deformed PCBs – unlike traditional screen-based glue dispensing systems. And the programming is also a lot faster, because all the pertinent data is already in the system.
For electronics manufacturers who need to selectively glue individual components, the SIPLACE Gluefeeder thus opens up an entire set of new options and significant cost and process benefits. SIPLACE will demonstrate the new Gluefeeder "live" at this year's SMT Hybrid Packaging trade show in Nuremberg, Germany (Hall 7 Booth 204). For more information, visit www.siplace.com/SMT2012.