An asymmetrical layer structure, the use of different materials or heat treatments or the stretching or compression of boards can lead to deformations that go beyond the tolerances for 01005 processes.
Circuit pattern, solder resist screen and solder paste printing
In 01005 processes, the position tolerance between the circuit pattern and the solder resist screen is limited to ±0.5 µm. Even the smallest contaminant in the paste printing process has a negative impact. That’s why electronics manufacturers are advised to coordinate the necessary process parameters with their suppliers and equipment manufacturers to ensure that everything works properly on the factory floor.
Since only a few manufacturers have as much practical 01005 process experience as SIPLACE, any claims like “01005-ready” should be taken with a grain of salt. Component supply, pickup position, the pickup process, optical inspection and positioning – each process step in the placement machine must be properly designed for 01005 capability.
Let’s look at two examples: If the machine has to readjust its head position when it picks up and/or places components, it instantly becomes a lot slower. The fact that the machine is unable to comply with its specifications in 01005 processes can lead to very unpleasant surprises. Machines placing 01005 components must also be equipped with special component sensors, because the traditional vacuum sensors are not capable of properly verifying the pickup and placement with 01005 components.
