SIPLACE Placement Systems | ASM Assembly Systems | SIPLACE Features and Options | SIPLACE Placement Heads

Each features state-of-the-art technology –
as a team they are unsurpassed

The SIPLACE X-Series “powered by MultiStar” covers the entire component spectrum and all requirements of modern electronics manufacturing with only three placement heads.

The SIPLACE MultiStar alone is able to handle components ranging from 01005 to 50 x 40 mm. The SIPLACE MultiStar needs support from the SIPLACE 20-nozzle Collect&Place SpeedStar or the high-precision SIPLACE TwinStar only when the application calls for the highly optimized placement of very small components or large and odd-shaped components.

Alternatively, the proven 6-nozzle and 12-nozzle Collect&Place heads of the SIPLACE D-Series and the SIPLACE X-Series “Classic Version” are available for fast and flexible electronics production.