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Placement Systems
SIPLACE SX-Series
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TwinStar
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SIPLACE TwinStar

 

Your benefits:

 

The Ultimate End Of Line Placement Head

Trouble-free placement of large, heavy components

 

Exotic Odd Shape Components

With customized grippers, SIPLACE TwinStar is able to handle any type of OSC.

 

The highly accurate SIPLACE TwinStar is our Pick&Place twin-head for the end-of-line placement of large, heavy and exotic components as well as of the placement of special packages. Its handling spectrum ranges from 0201 components to packages with dimensions of 200 x 100 mm.

In addition to a wide spectrum of nozzles, more than 120 grippers are available. The TwinStar’s standard features include: fine-pitch camera, vacuum sensor, force sensor, nozzle changer, PCB camber control and the high-resolution digital SIPLACE vision system. Options like the flip-chip camera and coplanarity module expand the application spectrum and enhance the placement quality of the SIPLACE TwinStar.

The SIPLACE TwinStar, which can be installed on all current SIPLACE series, delivers the flexibility electronics manufacturers need for their more unusual products and protects their investment.

 

Compatible with:

 
 
  • SIPLACE SX-Series

  • SIPLACE X-Series “Powered by SIPLACE MultiStar”

  • SIPLACE X-Series “Classic Version”

  • SIPLACE D-Series