This year’s APEX was only the second time that ASM shared a booth with its new Asian parent company ASM Pacific Technologies (ASMPT). The special highlight for ASMPT was the unveiling of its new MCM12 multichip module diebonder for the highly flexible placement of flip-chips in a wide range of applications.
Head of SIPLACE’s America cluster, Jeff Timms, said that the show was a great success with more visitors coming and lots of positive feedback to the company’s motto. The guests also confirmed that SIPLACE is definitely moving in the right direction.
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