Technology Show in Malaysia on 21 – 23 May, 2013
SIPLACE – World #1 in Technology

ASM Assembly Systems will be having the SIPLACE Technology Show in Penang, Malaysia from 21 to 23 May 2013 together with our partner SIP Technology Malaysia.

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New generation of the SIPLACE X-Series

ASM Assembly Systems recently unveiled the next generation of its successful SIPLACE X high-end platform. With the new generation of the SIPLACE X platform, ASM Assembly System is aiming to expand its market share in sophisticated high-speed applications.

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SIPLACE lines for automobile electronics and smartphones at Nepcon Shanghai 2013

Smartphones and automotive electronics — ASM Assembly Systems presented its new placement platforms and innovative line concepts for both SMT applications at this year’s Nepcon Shanghai trade show.

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SIPLACE New Di series on Electronics Bazaar

The new SIPLACE Di series introduction is published on Electronics Bazaar (May 2013 issue).

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Successful SMT 2013 for ASM Assembly Systems

New products from hardware, software and services: the ASM Assembly Systems booth at the SMT Hybrid & Packaging 2013 was a definite crowd pleaser.

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New Traceability Option: Reading barcodes on Circuit boards with the PCB Camera

With the latest Traceability option, the SIPLACE team has enhanced its capability to trace even individual PCB Circuit barcodes.

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Experience SIPLACE - at SMT Hybrid Packaging 2013

Hall 7, Booth 204, April 16-18, Nuremberg
 
With new SIPLACE placement machines and many software innovations, SIPLACE will present a multitude of new products in Hall 7, Booth 204 at this year’s SMT Hybrid Packaging in Nuremberg. Several highlights will be at the center of attention from April 16 to 18: With the SIPLACE X3 S, ASM Assembly System will unveil the new generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment. Also new is the SIPLACE Very High Force Head for placement forces of up to 70 newtons. The SIPLACE team will also demonstrate its leadership in the areas of software and workflow support for materials management.

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Great Success in SIPLACE Technology Show in Thailand 2013

At the SIPLACE Technology Show in Thailand 2013 held from 5th to 8th March 2013, the SIPLACE Team delivered the message of "SIPLACE – World #1 in Technology" with a host of technological innovations in hardware and software as well as live demonstrations.

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SIPLACE team completes successful APEX in San Diego

At this year’s APEX Expo, the SIPLACE team of ASM Assembly Systems continued to demonstrate how SIPLACE can simplify prominent and demanding electronics manufacturing challenges.

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SIPLACE Very High Force Head for SX Machines Review on Electronics Maker

The new SIPLACE Very-High-Force Head for SIPLACE SX placement machines review is published on Electronics Maker (February 2013 issue).

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APEX 2013 videos: SIPLACE experts talk up industry’s important topics

The APEX Expo in San Diego was a big success for the SIPLACE Team. SIPLACE Marketing Manager Americas Mark Ogden was excited about the show-goers’ response: "The SIPLACE booth was continually busy with visitors. We were very happy that our message was so well received." Interesting discussions and roundtables were held, and SIPLACE experts were ready to join in.

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ASM Assembly Systems at the SMT Hybrid Packaging 2013 show

New SIPLACE machines and premium solutions for electronics production

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Technology Show in Thailand on 5 – 8 March, 2013 - SIPLACE – World #1 in Technology

ASM Assembly Systems will be having the SIPLACE Technology Show in Bangkok, Thailand from 5 to 8 March at Jupiter 16 IMPACT, Muang Thong Thani.

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New Year Message from Mr. Gunter Lauber, CEO of the Global SIPLACE Team

New Year Message from Mr. Gunter Launber "We enter the year 2013 with a great deal of optimism".

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Saving time and money in LED placement - SIPLACE LED Pairing automates two-sided LED placement

With the new SIPLACE LED Pairing process, LEDs and their associated resistors can now be selected and placed on both sides of the circuit board. This saves time and makes placing LEDs and matching resistors even more efficient.

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SIPLACE Very-High-Force Head features placement force of 70 N - Lots of power for large connector modules

With its new SIPLACE Very-High-Force Head for odd-shaped components, ASM Assembly Systems is adding another major option for its SIPLACE SX placement machines. The new Very-High-Force Head is able to place components up to 30 millimeters high and 200 millimeters long with a force of up to 70 newtons.

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Grand Opening of new SIPLACE partner EASY facilities in Manaus - SIPLACE showcases excellent set up in Brazil

The SIPLACE team of ASM Assembly Systems, together with their Partner EASY hosted a Grand Opening of the new EASY Offices in Manaus. Customers and Prospects from the Manaus were invited to the Grand Opening Ceremony on December 13th.

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Solid Semecs extends its capabilities with SIPLACE SX

New approach delivers speed paired with flexibility and quality
 
Solid Semecs GmbH, a well-known electronics manufacturer has operated a production facility in Vrable, Slovakia decided to run its production with flexible and modular SIPLACE placement machines. The underlying motive: Semecs must be able to produce orders of all types and from all industries with exceptional flexibility.

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Year-End Message from Jack Chua, CEO, ASM Assembly Systems Singapore

Jack Chua, CEO, ASM Assembly Systems Singapore would like to thank all SIPLACE customers and friends for their support and summarize SIPLACE achievements in this year.

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SIPLACE Technology Days in Budapest

On October 16 and 17, the SIPLACE Technology Days took place in the Hungarian capital Budapest. Together with partner company DEK, a world-leading manufacturer of printer equipment, the SIPLACE team of ASM Assembly Systems presented to customers and visitors the latest technologies, innovations and products.

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Minimize your fault rates:
Always the right nozzle with SIPLACE nozzle ID

An automated production environment minimizes your fault rates, and the SIPLACE nozzle ID now eliminates another potential source of errors: effective immediately, standard SIPLACE nozzles carry an individual nozzle ID.

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SIPLACE team presented with "Global Excellence in Operations" Award

Great excitement for the SIPLACE team: ASM Assembly Systems was presented with the prestigious 2012 "Global Excellence in Operations" Award. The GEO award is part of the highly respected "Factory of the Year" competition in Germany, in which companies are honored each year that set benchmarks in their respective industries by successfully implementing exemplary concepts in management, quality control and production.

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SIPLACE Team is looking to grow
University Contact Show 2012 in Munich

Cars without navigation systems? Surfing without tablets and apps without smartphones? Not with SIPLACE: wherever PCBs are needed today, the Munich enterprise is involved. At the University Contact Show 2012 in Munich, more than 5000 students who are about to enter professional life took the chance to find out more about SIPLACE.

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SIPLACE at Surface Mount and Light Emitting Diodes Conference (SMaLED)

At this year’s Productronica India, the SIPLACE team was invited to join the second edition of Surface Mount and Light Emitting Diodes (SMaLED). The conference, organised by Trafalgar Publications Group and Messe Muenchen International, was held on 12 September 2012 at the Bangalore International Exhibition Centre (BIEC), in Bangalore.

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