Great success for the SIPLACE team at Nepcon Shanghai 2013:
SIPLACE X4i S wins three awards
At this year’s Nepcon Shanghai show the SIPLACE team received two highly influential awards for its new high-end SIPLACE X4i S platform: the EM Innovation Award China, the SMT China Vision Award and the SMT China Prime Product Award. For the fifth time running now, SIPLACE was able to win these prestigious awards, which are given out by independent panels. The SIPLACE X4i S impressed the panellists especially with its high performance rating, flexible features and great usability. With the new generation of the SIPLACE X platform, ASM Assembly Systems is aiming to expand its market share in sophisticated high-speed applications.
Faster, smaller and more flexible
New generation of the SIPLACE X-Series
New from SIPLACE: ASM Assembly Systems unveils the next generation of its successful SIPLACE X high-end platform. Although the new machines are up to 0.5 meters shorter than the previous generation, they offer up to ten percent more performance. For example, the new SIPLACE X4i S flagship delivers a top benchmark value of 120,000 cph (components per hour) in a footprint of only 1.9 x 2.6 meters. The new three-gantry and four-gantry models of the new high-end platform impress with significantly improved numbers for investment-critical ratios like floorspace/performance and price/performance. Slots for up to 160 8-mm feeders, conveyors for boards up to 650 mm wide, barcode readers, SIPLACE Smart Pin Support, interchangeable gantries and new tray feeders expand the flexibility and usability of the new platform for demanding high-speed applications in electronics production.
SMT show success -
Great interest in new SIPLACE machines
Thanks to many new products from the areas of hardware, software and services, ASM Assembly Systems’ booth at the SMT Hybrid & Packaging 2013 scored high visitor numbers. The great interest was not only created by putting a focus on "SIPLACE solutions for the entire production workflow" – two new SIPLACE placement machines also were successfully unveiled this year. The new SIPLACE X3 S is the latest generation of the SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment. Thus the SIPLACE team presented intelligent solutions from both ends of its product range. Gabriela Reckewerth, Director Global SIPLACE Marketing, was happy with the great response:
ASM Assembly Systems at Nepcon Shanghai 2013
SIPLACE lines for automobile electronics and smartphones plus many new product highlights
Smartphones and automotive electronics — ASM Assembly Systems will present new placement platforms and innovative line concepts for both SMT applications at the upcoming Nepcon Shanghai trade show (April 23-25, Shanghai World Expo Center, Booth 1C20). On the smartphone line, the latest generation of SIPLACE placement solutions will be unveiled: both the SIPLACE X4i S and the SIPLACE X3 S deliver record performance ratings. The four 20-nozzle SIPLACE SpeedStar heads on the SIPLACE X4i S push its maximum theoretical speed rating to 135,000 cph (102,000 cph according to the IPC standard). In addition to its faster performance, the new SIPLACE X-Series also features new options for more flexibility. The automotive electronic line on the other hand focuses more on process reliability, traceability and the special requirements of the LED placement process. Another surprise awaits visitors who expect SIPLACE to be active exclusively in the premium segment:
Great Success for SIPLACE Technology Show in Thailand
ASM Assembly Systems invited more than 60 customers from a wide range of industries to their SIPLACE Technology Show, which took place in Thailand from 5th to 8th March 2013. Delivering the message of "SIPLACE – World #1 in Technology", a host of technological innovations in hardware and software, semiconductor packaging trends as well as live demonstrations was presented.
SIPLACE team completes successful APEX in San Diego
At this year’s APEX Expo, the SIPLACE team of ASM Assembly Systems continued to demonstrate how SIPLACE can simplify prominent and demanding electronics manufacturing challenges. "Over the course of our three show days the response to our live demonstrations and innovative products on display was great and the SIPLACE booth was continually busy with visitors. We were very happy that our message was so well received," said Mark Ogden, SIPLACE Marketing Manager Americas.
ASM Assembly Systems at the SMT Hybrid Packaging 2013 show
New SIPLACE machines and premium solutions for electronics production
With new SIPLACE placement machines and many software innovations, ASM Assembly Systems underscores how important the SMT Hybrid Packaging trade show in Nuremberg (April 16th - April 18th) has become. At Booth 7-204, the SIPLACE team will present innovations from both ends of its platform spectrum: With the SIPLACE X3 S, it unveils the latest generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment. Also new is the SIPLACE Very High Force Head for placement forces of up to 70 newtons.
SIPLACE at the 2013 APEX show
SIPLACE software combined with flexible hardware makes all the difference
After a record year, the SIPLACE team of ASM Assembly Systems wants to keep expanding its market position in North and South America. The official start of this campaign will be the APEX Expo 2013 show in San Diego (Feb. 19-21, 2013, Booth 215). At the center of the company’s show agenda will be the highly flexible SIPLACE SX placement platform with its many efficiency-enhancing hardware and software options.
Saving time and money in LED placement
SIPLACE LED Pairing automates two-sided LED placement
With its LED Pairing feature, the SIPLACE team of ASM Assembly Systems had already simplified the complex LED placement process significantly by automating the time-consuming management of different brightness classes and matching resistors. Now the company’s engineers have advanced this successful principle even further: With the new SIPLACE LED Pairing process, LEDs and their associated resistors can now be selected and placed on both sides of the circuit board.
SIPLACE Very-High-Force Head features placement force of 70 N
Lots of power for large connector modules
With its new SIPLACE Very-High-Force Head for odd-shaped components, ASM Assembly Systems is adding another major option for its SIPLACE SX placement machines. The new Very-High-Force Head is able to place components up to 30 millimeters high and 200 millimeters long with a force of up to 70 newtons.