Rising attendance and lots of positive feedback
SIPLACE pleased with results of APEX 2012
Under the motto "Simplify your manufacturing challenges", the SIPLACE team faced its customers’ challenges at the show ‘live’ and presented solutions in the areas of new product introduction (NPI), setup changeover and production run. In addition to the SIPLACE SX placement platform, the company’s highlights included innovations such as the SIPLACE Smart Pin Support, the flexible SIPLACE Glue Feeder and SIPLACE LED Pairing.
"The show was a great success for us: there were more visitors than last year and many of them were interested in our innovative production concepts. We also received lots of positive feedback to our motto of ‘Simplify your manufacturing challenges’. Our guests confirmed that we are definitely moving in the right direction," summarised Jeff Timms, head of SIPLACE’s Americas cluster. This year’s APEX was only the second time that ASM Assembly Systems shared a booth with its new Asian parent company ASM Pacific Technologies (ASMPT). The special highlight for ASMPT was the unveiling of its new MCM12 multichip module diebonder for the highly flexible placement of flip-chips in a wide range of applications.
This year’s APEX welcomed 26 percent more visitors than last year’s show, and many of them stopped by the SIPLACE booth to learn more about the latest products and services as well as the SIPLACE Challenge campaign. A major highlight was the SIPLACE SX placement platform, which combines capacity-on-demand capabilities with easy operation. And this year’s motto "Simplify your manufacturing challenges" demonstrated that having the right product solutions lets you master any manufacturing challenge.
New software versions and placement solutions make production processes and operations easier and more efficient, as the SIPLACE team demonstrated at its booth in an impressive manner. Innovative product technologies like the SIPLACE Smart Pin Support, the SIPLACE Glue Feeder and the SIPLACE LED Pairing software function excited current users as well as potential new customers. The multichip module diebonder 12 technology, which places flip-chips for a wide range of applications with exceptional accuracy, was a special show highlight for ASMPT.
In the SIPLACE Challenge Cup Arena, all innovations were demonstrated ‘live’ as the SIPLACE team faced its customers’ everyday challenges in the areas of new product introduction (NPI), changeover and production run. The large numbers of visitors at the booth confirmed the validity of the show’s concept, which had its premiere at last fall’s Productronica trade show in Munich. Good preparation and effective teamwork pay off not only on the trade show floor, however. The synergies between ASM and ASMPT also enhanced the existing SIPLACE product portfolio and strengthened its potential even more. SIPLACE’s messages and the consistently positive visitor feedback produced not only new customers, but confirmed the sustained growth potential of ASM.
Many visitors at the SIPLACE booth learned more about the latest products and services as well as the SIPLACE Challenge campaign. This year's APEX welcomed 26 percent more visitors than last year's show.