“Not just a new placement head, but a major step towards highly flexible, universal SMT production lines”
The SIPLACE team’s new MultiStar is the first placement head that combines the speed of Collect & Place technology with the versatility of Pick & Place. In this interview, SIPLACE product marketing manager Wolfgang Heinecke explains why he and the SIPLACE team want to reduce the number of special heads and how electronics manufacturers can use CPP heads to make their lines much more flexible than before.
Video SIPLACE MultiStar
