New Chip Assembly Technology
Makes it possible to place dies directly from the wafer on the basis of the standard SMT placement process
High speed and maximum accuracy
Combines the speed of an SMT placement machine with the accuracy of a die bonder
Integrated feeding directly from the wafer
Three processes on a single platform
Supports flip chip, die attach and SMT processes
on the same platform
Flexible machine/line configuration
To meet your product(ion) requirements
The SIPLACE Wafer System’s setup is easy to change
