SIPLACE Wafer System
Supports flip chip and die attach processes
Wafer size: 4" to 12"
Horizontal system
Automatic wafer changer
Multi-die capability
SIPLACE Linear Dipping Unit
Accurate and reliable dip height
Freely programmable flux application speed
Programmable hold time
SIPLACE Dual Conveyor
Simultaneous processing of two different products in asynchronous mode
Side-by-side processing of PCB top and bottom in synchronous mode
