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SIPLACE lines for automobile electronics and smartphones
SIPLACE at: Shangai, Nepcon 2013
Smartphones and automotive electronics - ASM Assembly Systems presented its new placement platforms and innovative line concepts at this year’s Nepcon Shanghai trade show. On the smartphone line, the latest generation of SIPLACE placement solutions was unveiled: both the SIPLACE X4i S and the SIPLACE X3 S deliver record performance ratings. The automotive electronic line with the SIPLACE flagship SIPLACE SX focused more on process reliability, traceability and the special requirements of the LED placement process. ASM Assembly Systems comes to a successful close at SMT 2013 show
From April 16th to 18th the SMT Hybrid Packaging trade show took place in Nuremberg. ASM Assembly Systems aimed to promote the new hardware, software and service innovations to the interested visitors and was able to impress with its high quality. The new placement machine SIPLACE X3 S (the latest generation of the high-end platform SIPLACE X) and the SIPLACE D1i (a new solution for the more price-sensitive SMT production segment) were accountable for the high attendance and the very project-oriented discussions. SIPLACE solutions for special regional requirements
SIPLACE at: Wuhan, China
On March 22th, the second SIPLACE technology seminar, aimed to promote innovative SIPLACE technology, was held in Wuhan. The SIPLACE experts presented the new SIPLACE Di-series and the comprehensive SIPLACE software portfolio to a total of 32 interested customers from the region. The hardware, software and service presentations were specifically suited to the booming Chinese electronics manufacturing market. More flexibility for a diverse market
SIPLACE at: Brno, Czech Republic
At the AMPER 2013, the Trade Fair of Electrotechnics, Electronics, Automation and Communication Technology, the SIPLACE team went to display its high flexibility flagship platform SIPLACE SX, as well as such revolutionary features like the SIPLACE Glue Feeder or the SIPLACE MultiStar placement head. For the electronics manufacturing market in Eastern Europe, which gets more and more into the flexible high mix direction, these are ideal SIPLACE solutions. Number #1 all over the world
SIPLACE at: Bangkok, Thailand
At the SIPLACE Technology Show in Thailand 2013, from March 5 to 8, the SIPLACE Team delivered the message of "SIPLACE – World #1 in Technology" with a host of technological innovations in hardware and software as well as live demonstrations. The daily event included a presentation on packaging market trend, SIPLACE Technology and common manufacturing challenges that customers face in view of the "High Mix/Low Volume" environment. Ahead of the competition with superior technology
SIPLACE at Böblingen, Germany
“How does Germany stay competitive?” was the topic of the first InnovationsForum at Böblingen. Jörg Grote, SIPLACE Head of Sales Germany South, gave a presentation about “High Speed for your production: fast and intelligent product changeovers” to around 170 interested participants. In collaboration with EPP and EMSNow the SIPLACE team went to prove that superior technology is still the decisive factor for success. Special focus on SIPLACE SX and software features
SIPLACE at: Lodz, Poland
In the past week, together with its new sales partner JSD Polska, the SIPLACE team held the “JSD and SIPLACE Tech Forum 2013”. Around 60 participants took a special interest in the high flexibility SIPLACE SX series, as well as software features such as SIPLACE Setup Concepts, Traceability and material management. ‘Simplify’ with SIPLACE at APEX 2013
SIPLACE at: San Diego, USA
At the center of the company’s show the SIPLACE Team of ASM Assembly Systems presented the highly flexible SIPLACE SX placement platform Februrary 19 to 21. A special focus was on the SIPLACE Team’s intelligent software solutions. Another highlight was the demonstration of SIPLACE’s Random Setup concept. Other innovations shown at the booth 215 included the SIPLACE Smart Pin Support, the SIPLACE Glue Feeder and the SIPLACE Smart GUI. 2012 CEE Roadshow comes to a successful end
SIPLACE at: Prague, Czech Republic, & Nitra, Slovakia
The SIPLACE team had two more stops on its Eastern Europe Roadshow during the past two weeks, in Prague, Czech Republic, and Nitra, Slovakia. Here customers and visitors were presented with a tried and true formula of expert presentations and live machine demonstrations all around the SIPLACE portfolio. In 2013, the SIPLACE team will continue its successful tour. Gain industry experience with SIPLACE
SIPLACE at: Munich, Germany
This year once again, SIPLACE Technology Scout Norbert Heilmann organized the hands-on training “Industrial Design”, together with Michael Pfeffer of the FAPS (Department for Automated Production and Production Systematics) of the University Erlangen-Nuremberg. An exciting task awaits the participating students: they will develop a concept for the improvement of the SIPLACE user interface – inspired by current smartphone operation concepts. Kicking off the four-month-long project, the students travelled to Munich in order to take a closer look at their study subject, the SIPLACE SX. CIEN & MATELEC 2012 – Small SIPLACE Revolutions
SIPLACE at: Paris, France & Madrid, Spain
The SIPLACE team confirmed its market-leading position with its show presence at French electronics show CIEN and Spanish MATELEC; it also presented new solutions to further simplify electronics production in the future. Much in demand: SIPLACE software and technology like the SIPLACE Glue Feeder, the portable gluing station which can be set up like a feeder. “2012, the focus was on the small SIPLACE revolutions – investments like SIPLACE Smart Pin Support and the Glue Feeder are able to multiply a production’s possibilities”, said Catherine Krauss, Marketing Head South West Europe. Great response at the German SIPLACE Technology Days
SIPLACE in: Munich, Germany
Interest in the German SIPLACE Technology days this year exceeded all expectations: more than 150 customers wanted to come to Munich to refresh, extend and recharge their SIPLACE knowledge. In order to leave enough time to questions and individual challenges, the SIPLACE team promptly set down two dates and welcomed another 80 visitors again in October. “We want to have enough time for all of our customers. Communication is the most important thing to us on such occasions”, said SIPLACE Head Germany South Jörg Grote. “Talking with each other, questions, challenges we get to analyze – it’s fantastic that so many of our customers come to share their opinions with us.” Eye on Eastern Europe
SIPLACE at: Budapest, Hungary
On October 16 and 17, the SIPLACE Technology Days took place in the Hungarian capital Budapest. The SIPLACE team presented to customers and visitors the latest technologies, innovations and products. “With these Technology Days we really focused on the needs and challenges of Eastern European electronics manufacturers. The market of this region grows more versatile, and the customer expectations rise. We want to prove SIPLACE is the perfect partner to become even more successful”, said Sven Bucholz, Head of SIPLACE Cluster CEE. Insights into everyday SMT life
SIPLACE in: Munich, Germany
About 40 students of the Heilbronn University paid a visit to the SIPLACE team in Munich together with their professor Wolfgang Wehl in the context of a SMT lecture during winter semester 2012/2013. The event was not just an introduction into Surface-Mount-Technology – the SIPLACE experts wanted to make clear to the visitors that nowadays, software and new, innovative technologies have become just as important as fast machines. “The students learn all about theory at their lectures. During their SIPLACE visit, we wanted to offer them a very praxis-oriented insight into everyday SMT life – and help to spark their interest in this topic a little further!” said Norbert Heilmann, SIPLACE Technology Scout. Up-To-Date with SIPLACE
SIPLACE in: Kranj, Slovenia & Sofia, Bulgaria
The very latest from the areas of hardware, software and services – putting a strong focus on the Central Eastern Europe region, the SIPLACE team presented customers with new technology developments in Kranj and Sofia during two Technology Seminars in the last weeks. Whether high-mix or high-volume productions, with presentations of the SIPLACE D-Series and the SIPLACE SX as well as small industry revolutions like the SIPLACE Glue Feeder and SIPLACE LED pairing, the SIPLACE experts went on to prove that the company’s portfolio offers perfect solutions for any kind of challenge. SIPLACE SX Road Show continues
SIPLACE in: Mississauga, Canada
A first successful stop in New England, now the SIPLACE SX 2012 North American Road Show moved on to Mississauga, Ontario where the SIPLACE team’s SX platform once more proved the most flexible solution in the market. One week, two customer groups per day – the Road Show was fully booked. Mark Ogden, SIPLACE Marketing Manager, explained: “There are many ways the SIPLACE SX can revolutionize difficult production tasks. The road shows enable us to show our customers how they can simplify what robs them of their valuable time.” Innovations in all areas at the SIPLACE Customer Days
SIPLACE in: Munich, Germany
Nothing was left out at the big SIPLACE Customer Days Germany on 13. and 14. September 2012: the event was all about news and innovations from the entire broad SIPLACE product portfolio. Presentations, customer references, live demonstrations and tours – the SIPLACE experts from the areas of hardware, software and services made it clear: for all the individual challenges of the over 70 customers, SIPLACE has a solution. “We have a lot of new designs to show and want to share them with our customers”, Sabine Drechsler from the SIPLACE team explained. “And of course with events such as this both sides are winning: we keep our customers up-to-date. In return we can hear whether there are new challenges they are facing – then we have to react and get back to work.” German Engineering and Asian Efficiency
SIPLACE in: Shenzhen, China
Great visitor numbers and a lot of positive responses for the SIPLACE Team’s show concept at the Nepcon Shenzhen last week. The SIPLACE team presented an upgraded version of its SIPLACE D4 placement platform, the new SIPLACE D4i, as well as intelligent SIPLACE software. Customer challenges were solved at the booth where the SIPLACE team celebrated the successful combination of German engineering and Asian efficiency with typical German food and drink as well served by SIPLACE team members in traditional Bavarian dress.
SIPLACE continues to show its commitment to India
SIPLACE in: New Dehli and Bangalore, India
In conjunction with the establishment of ASM Assembly Systems India Pvt. Ltd. in April 2012, "ASM Assembly Systems India Inauguration cum SIPLACE Convention" was held in the city of New Delhi on 24 July 2012 and Bangalore on 27 July 2012. In the event distinguished guests gained insights not only into the new ASM Assembly Systems organization but also the latest technology roadmap and SIPLACE manufacturing solutions. In different presentations, electronics manufacturers learned how SIPLACE is now operating as an independent business unit under ASM Pacific Technology and how the synergies between the two companies have created the perfect combination of German Engineering and Asian Efficiency. Furthermore, through SIPLACE Convention, SIPLACE discussed with the customers different solutions in terms of Technology, Flexibility and Services. Visit of Mercedes-Benz:
High Level Quality for the field of Automotive
SIPLACE in: Munich, Germany
Quality, as well as perfection and safety are key for automotive manufacturers. For German automaker Mercedes-Benz, too, electronics features in the car play a more and more important role. Therefore the SIPLACE team in Munich invited ca. 20 employees to present to them the most innovative way to produce efficiently in the areas of electronics manufacturing and SMT production despite the strict quality specifications and while keeping costs low. The flagship platform for Automotive production, the SIPLACE SX, was of special interest. “Due to its high placement accuracy, its state-of-the-art Vision systems and its three flexible placement heads the SIPLACE SX perfectly matches the demands of the Automotive industry”, Bernhard Fritz, SIPLACE product marketing hardware, explained.
 SIPLACE returns to JISSO Protec
SIPLACE in: Tokyo, Japan
With even stronger focus on innovation the SIPLACE team returned to JISSO Protec, at the Tokyo Big Sight on 13th-15th June 2012. Together with our partner, the Japanese distributor ECOTS Japan the SIPLACE team demonstrated its market leading solutions for typical Japanese production challenges. Highlight of the show was the SIPLACE SX, the world’s first placement machine with gantries to be added or removed within only minutes, and thus combining capacity-on-demand with maximum speed and performance. Jack Chua, Chief Executive Officer of ASM Assembly Systems Singapore Pte Ltd, remarked: “As the latest electronics technology is mostly developed in Japan, our development team is continually working towards meeting our customers’ high demands and expectations here. We are confident that our synergy with the ASMPT group will help us to put even more focus on Japanese companies and we are looking forward to further developing the business with our existing Japanese accounts.”
SIPLACE excels at the Grand Opening USA
SIPLACE in: Suwanee, USA
In Suwanee, Georgia, the SIPLACE team showed its strength at the SIPLACE Grand Opening – with an exciting program which offered everything from roundtables to factory tours and the introduction of the SIPLACE SX Simplify concept. “We had not expected something like this, so much detailed information on the American market, on the SX and the really innovative technology”, visitors all agreed on the event. Roundtables with topics such as “Manufacturing challenges in the Americas”, “Best-in-class solutions for American electronics manufacturers’ and ‘The future of electronics manufacturing in the Americas’ were of special interest and many visitors participated actively on the vivid discussions. The conclusion despite all challenges – electronics manufacturers in the Americas are once again a force to consider. They are strong and back with great flexibility, speed, and technological innovations, especially when it comes to processes. Together with SIPLACE the target is clear: find the best solutions for all customers. Finally, SIPLACE CEO Günter Lauber and Jeff Timms, head of the Americas SIPLACE team, officially inaugurated the new site in Suwanee with a ribbon cutting ceremony. SIPLACE showcases SX innovations in Poland
SIPLACE in: Sieradz, Poland
During the SIPLACE Technology Days from June 26 – 27, the SIPLACE team presented for the first time to the Polish market its high flexibility SIPLACE SX placement platform at the EMS company Partnertech in Sieradz. The 28 participants were especially impressed with the SX series’ revolutionary fast gantry exchange. There was also a lot of time to look into the specific challenges of Polish companies: SIPLACE NPI tools like Vision Teaching and the SIPLACE MultiStar placement head proved to be of great interest there. “We use such opportunities as the Technology Days in Poland to take our SIPLACE innovations directly to the customers, so that we can show them what our software and hardware really can do by now. This exchange means that both our customers and of course ourselves stay up to date”, said Bernhard Fritz, head of SIPLACE Product Marketing Hardware. Dynamic concepts at the SIPLACE SMT Symposium
SIPLACE in: Tallinn, Estland
The SIPLACE team, together with partners Asys and Rehm last week hosted a SMT Symposium in Tallinn, Estonia, in order to give customers an overall product update combined with the latest news on SIPLACE setup concepts, technology trends and SIPLACE service products. After earlier events in Sweden, Denmark and Finland we again put a strong emphasis on the SIPLACE portfolio of hardware, software and services, this time focusing also on the combination of SIPLACE products with those of Rehm and Asys to show how customers can achieve maximum speed and flexibility with the company’s joint concepts. Ola Andersson, SIPLACE Sales in Europe North, was excited about the event: “By showcasing our latest technologies together, we can really broaden the discussion to find solutions for our customer’s challenges.” For the seventh time: Seminar “In Depth“
SIPLACE in: Dresden, Germany
For the seventh time already the yearly seminar “In Depth” took place in Dresden and once more the SIPLACE team was one of the partners that presented to electronics manufacturers and customers their know-how and the latest developments in design and production. One of the highlights and a definite crowd-puller was SIPLACE Technology Scout Norbert Heilmann’s lecture “Gluing upside down – even for three-dimensional circuits” about the SIPLACE gluefeeder which was available for closer examination later on. Dieter Rentzsch, SIPLACE Sales, is convinced of the event’s many positive aspects: “The greatest advantage of the “In Depth” Seminar is – besides the interesting presentations of course – the many possibilities to get in touch. We speak to our customers about their concerns and so we learn how SIPLACE can offer them the best support possible.” SIPLACE “New Product Introduction” tools
at inaugural ENOVA
SIPLACE in: Tunis, Tunisia
For the first time the ENOVA, a new show dedicated to the electronics industry, took place from 13 to 16 June 2012 in Tunis, Tunisia. Strongly supported by the Tunisian authorities and organized by MEDINDUSTRIE, the International Exhibition for Industrial Cooperation and Innovation, all the main players in the electronics industry in Tunisia, either OEM manufacturers or subcontractors, were present as exhibitors as well as visitors. SIPLACE participated at the show with the concept “New Product Introduction” and showcased clever NPI tools such as the SIPLACE gluefeeder and the SIPLACE smart pin support. SIPLACE User Group Meeting: Legends United
SIPLACE in: Manchester, England
Following the very successful SIPLACE User Meeting at Schrader Electronics in Belfast earlier this year, a second User Meeting was scheduled to take place in Manchester at the end of May. The event was held at Old Trafford, home to all great legends, sports and technology alike.
30 customers from a wide range of electronics industries and with varying background of SIPLACE Technology attended this one-day event. The SIPLACE User Group in itself is legendary: the very first UK & Ireland SIPLACE User Group was held in October 1988 and subsequently became a very successful annual event. Placement technology was still in its infancy then, but the SIPLACE team recognized early on that by working with the customers and listening to their particular manufacturing requirements and challenges, placement technology can be further innovated. 4th Berlin Technology Forum: Voids in soldering joints
SIPLACE in: Berlin, Germany
One May 31, several well-known German companies hosted the fourth Technology Forum in Berlin. This year the main topic was the problem of voids in soldering joints, one of the most interesting phenomena in soft-soldering. Siemens CT investigated the causes of such voids during presentations and workshops. Especially when large areas are soldered, voids can be created by an uneven flow of brazing solder and flux. Experts from the hosting companies Rehm, ASM Assembly Systems, Christian Koenen, Asys, Kolb, Siemens and Zevac presented many innovative ways of minimizing these voids. For the SIPLACE experts, the well-attended forum was an excellent opportunity to get in touch with new and old contacts, and to find out more about the latest developments in the industry. “The Berlin Technology Forum is always perfectly organized. This year, the topic was especially interesting for the SIPLACE team, because we always try to understand our customers’ processes and challenges as thoroughly as possible. We learned a lot today,” said Dieter Rentzsch, SIPLACE Head of Sales, Northern Region. Large stream of visitors on the SMT 2012
SIPLACE Challenge Cup convinces in Nuremberg
The SIPLACE booth on the SMT Hybrid Packaging 2012 in Nuremberg was well attended. The large stream of visitors showed much interest on the SIPLACE Team solving live actual challenges in the fields of NPI, changeover and production run. Beside the show concept, the visitors were impressed by the SIPLACE GlueFeeder and the new SIPLACE Maintenance concept, which provides more freedom for maintenance measures. Nepcon 2012 Great success for the SIPLACE Team
SIPLACE Challenge Cup in Shanghai
For SIPLACE the 2012 Nepcon trade show in Shanghai was a definite success: the unusual show concept and program helped to make an impression and visitors were excited about the perfect combination of German engineering and Asian efficiency on display. The challenges in the areas of new product introduction, changeover and production run which were posed to the SIPLACE Team by customers were promptly solved in the SIPLACE Challenge Arena. Also Manuela Roderer from the SIPLACE Marcom Teams confirms: "I am quite certain that it was not only because of our bavarian dirndls and the tasty ginger bread hearts that our customers repeatedly told us that they are convinced about the technological leadership of the SIPLACE placement solutions. They definitely trust in the SIPLACE's future within ASMPT." SIPLACE experts in Odense
SIPLACE in: Odense, Denmark
The second SIPLACE Technology Symposiums in April was held in Odense, Denmark. 20 customers from a broad spectrum of companies all over Denmark attended the event. SIPLACE experts Norbert Heilmann, Technology Scout, and Hubert Egger, Product Manager, talked about innovative technology trends and presented current SIPLACE highlights and the comprehensive SIPLACE software portfolio to their Danish customers. SIPLACE success in France
SIPLACE in: Paris, France
The SIPLACE team welcomed over 60 industry representatives at its 2012 Technology Days in France. At the center of the event, which SIPLACE organized in cooperation with DEK partner MJB, were SIPLACE solutions for optimized NPI processes. In technical workshops, the electronics manufacturers learned how to create and test placement programs offline despite missing CAD data and incomplete component descriptions, or how to insert products into the production flow with no line stops thanks to intelligent setup concepts. Globalization and people
SIPLACE in: Munich, Germany (SIPLACE HQ)
For the second time, the SIPLACE team welcomed approximately 30 members of the Institut für Produktionserhaltung (Institute for Production Maintenance) to its “Lean Development” symposium in Munich. All the speakers paid special attention to the Institute’s main focus: Maintaining production sites and building new ones in Germany and Europe with innovative value creation that focuses on the employee. The SIPLACE team is a prime example of this approach. “In many respects, SIPLACE may be a positive exception,” said Günter Schindler. Quality and efficiency
SIPLACE in: Blaubeuren, Germany
During the Rehm Technology Days in Blaubeuren near Ulm, SIPLACE presented innovative solutions for the challenges facing many electronics manufacturers today. Besides attending presentations on the subjects of “Living Quality” and “Improving Efficiency”, visitors and customers could attend workshops and receive lots of information about the latest developments in the electronics industry. Jörg Grote, SIPLACE Sales Manager for Southern Germany, was excited about the format of the Technology Days and their popularity: “Like they do every year, our colleagues at Rehm organized everything perfectly, and we were glad that so many people had accepted the invitation. Our customers like to attend this event, because it allows them to talk with all participants in the SMT supply chain about the best solution for their production.” All-around positive results
SIPLACE in: San Diego, California
The SIPLACE team was very pleased with this year’s APEX trade show. Under the motto “Simplify your manufacturing challenges”, SIPLACE faced its customers’ challenges head-on and presented production solutions in the areas of new production introduction and planning, changeover, and production run. In addition to the SIPLACE SX placement platform, the centers of attention were the SIPLACE Smart Pin Support, the flexible SIPLACE Glue Feeder and SIPLACE LED Pairing. Flexible solutions that impress
SIPLACE in: Munich, Germany (SIPLACE HQ)
Together with Hilpert Electronics, the SIPLACE team hosted its fifth Technology Day for customers and other interested parties. The Swiss guests received a direct look at the broad spectrum of hardware, software and services at the company’s headquarters in Munich. At the center of attention were the SIPLACE innovations that will hit the market still this year. The participants agreed: “It is truly impressive to see what you can accomplish with SIPLACE solutions today.” SIPLACE Technology Days
SIPLACE in: Oulu, Finland
After its great success at the 2011 Productronica trade show in Munich, the SIPLACE team is now presenting its latest innovations and technologies all over the world. At SIPLACE Technology Symposiums, SIPLACE experts are showing off their solutions for everyday production challenges. The first symposium was held in January in Oulu, Finland. “Let’s do this again”
SIPLACE in: Carrickfergus, Ireland
Second SIPLACE Technology Symposium in 2012: For the first time, the SIPLACE User Day for Great Britain and Ireland was held at Schrader Electronics in Carrickfergus, County Antrim, Ireland. Schrader Electronics produces solution for automotive and industrial application all over the world in its facility. The company has used SIPLACE production solutions for over ten years. Michael Quinn, Corporate Process Technology Manager at Schrader Electronics, was pleased with the event: “This first meeting went very well, and the feedback was highly positive. Let’s do this again, and next time we can delve into the subject from a more advanced starting point.”
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