AMS Assembly Systems at JISSO PROTEC 2013 in Japan
Continued branding of SIPLACE through JISSO Protec 2013 participation
New SIPLACE partner Technica USA
Technica USA has been signed to represent ASM Assembly Systems’ SIPLACE products in the Western USA. The SIPLACE team will also open a second US demo center, located at the Technica facility in San Jose, California. "In 2012 we significantly increased our market share in North America. Our intent is to continue this trend while offering our growing customer base exceptional service and process support throughout the region," says SIPLACE head Americas Jeff Timms.
Great success achieved at SIPLACE Technology Show in Penang, Malaysia 2013
At the recent SIPLACE Technology Show in Penang, Malaysia held from 21 to 23 May together with our partner SIP Technology Malaysia, ASM Assembly Systems achieved great success showcasing our products and solutions to the manufacturers.
New SIPLACE Second Level Reel Holder
More space and increased usability: for the SIPLACE X changeover tables, the SIPLACE team now offers a new Second Level Reel Holder. Perfectly suited for products requiring high volumes of mostly small components, the Second Level Reel Holder allows for easier transportation and faster and more efficient setups and changeovers.
In a class by itself SIPLACE Di-Series offers unique price-performance ratio
After 6 successful years in the market of Placement Systems, the SIPLACE team has launched the successor to the SIPLACE D-Series. The newly introduced SIPLACE Di-Series Placement System comes with improved features and increased usability.
Technology Show in Malaysia on 21 – 23 May, 2013
SIPLACE – World #1 in Technology
ASM Assembly Systems will be having the SIPLACE Technology Show in Penang, Malaysia from 21 to 23 May 2013 together with our partner SIP Technology Malaysia.
New generation of the SIPLACE X-Series
ASM Assembly Systems recently unveiled the next generation of its successful SIPLACE X high-end platform. With the new generation of the SIPLACE X platform, ASM Assembly System is aiming to expand its market share in sophisticated high-speed applications.
SIPLACE lines for automobile electronics and smartphones at Nepcon Shanghai 2013
Smartphones and automotive electronics — ASM Assembly Systems presented its new placement platforms and innovative line concepts for both SMT applications at this year’s Nepcon Shanghai trade show.
SIPLACE New Di series on Electronics Bazaar
The new SIPLACE Di series introduction is published on Electronics Bazaar (May 2013 issue).
Successful SMT 2013 for ASM Assembly Systems
New products from hardware, software and services: the ASM Assembly Systems booth at the SMT Hybrid & Packaging 2013 was a definite crowd pleaser.
New Traceability Option: Reading barcodes on Circuit boards with the PCB Camera
With the latest Traceability option, the SIPLACE team has enhanced its capability to trace even individual PCB Circuit barcodes.
Experience SIPLACE - at SMT Hybrid Packaging 2013
Hall 7, Booth 204, April 16-18, Nuremberg
With new SIPLACE placement machines and many software innovations, SIPLACE will present a multitude of new products in Hall 7, Booth 204 at this year’s SMT Hybrid Packaging in Nuremberg. Several highlights will be at the center of attention from April 16 to 18: With the SIPLACE X3 S, ASM Assembly System will unveil the new generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment. Also new is the SIPLACE Very High Force Head for placement forces of up to 70 newtons. The SIPLACE team will also demonstrate its leadership in the areas of software and workflow support for materials management.
Great Success in SIPLACE Technology Show in Thailand 2013
At the SIPLACE Technology Show in Thailand 2013 held from 5th to 8th March 2013, the SIPLACE Team delivered the message of "SIPLACE – World #1 in Technology" with a host of technological innovations in hardware and software as well as live demonstrations.
SIPLACE team completes successful APEX in San Diego
At this year’s APEX Expo, the SIPLACE team of ASM Assembly Systems continued to demonstrate how SIPLACE can simplify prominent and demanding electronics manufacturing challenges.
SIPLACE Very High Force Head for SX Machines Review on Electronics Maker
The new SIPLACE Very-High-Force Head for SIPLACE SX placement machines review is published on Electronics Maker (February 2013 issue).
APEX 2013 videos: SIPLACE experts talk up industry’s important topics
The APEX Expo in San Diego was a big success for the SIPLACE Team. SIPLACE Marketing Manager Americas Mark Ogden was excited about the show-goers’ response: "The SIPLACE booth was continually busy with visitors. We were very happy that our message was so well received." Interesting discussions and roundtables were held, and SIPLACE experts were ready to join in.
ASM Assembly Systems at the SMT Hybrid Packaging 2013 show
New SIPLACE machines and premium solutions for electronics production
Technology Show in Thailand on 5 – 8 March, 2013 - SIPLACE – World #1 in Technology
ASM Assembly Systems will be having the SIPLACE Technology Show in Bangkok, Thailand from 5 to 8 March at Jupiter 16 IMPACT, Muang Thong Thani.
New Year Message from Mr. Gunter Lauber, CEO of the Global SIPLACE Team
New Year Message from Mr. Gunter Launber "We enter the year 2013 with a great deal of optimism".
Grand Opening of new SIPLACE partner EASY facilities in Manaus - SIPLACE showcases excellent set up in Brazil
The SIPLACE team of ASM Assembly Systems, together with their Partner EASY hosted a Grand Opening of the new EASY Offices in Manaus. Customers and Prospects from the Manaus were invited to the Grand Opening Ceremony on December 13th.
Solid Semecs extends its capabilities with SIPLACE SX
New approach delivers speed paired with flexibility and quality
Solid Semecs GmbH, a well-known electronics manufacturer has operated a production facility in Vrable, Slovakia decided to run its production with flexible and modular SIPLACE placement machines. The underlying motive: Semecs must be able to produce orders of all types and from all industries with exceptional flexibility.
SIPLACE at Surface Mount and Light Emitting Diodes Conference (SMaLED)
At this year’s Productronica India, the SIPLACE team was invited to join the second edition of Surface Mount and Light Emitting Diodes (SMaLED). The conference, organised by Trafalgar Publications Group and Messe Muenchen International, was held on 12 September 2012 at the Bangalore International Exhibition Centre (BIEC), in Bangalore.